Job Description Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and 2 new greenfield sites in Ohio and Germany. Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development (TD) team, and FSM fab managers. This job requisition is seeking a Failure Analysis & Fault Isolation (FA/FI) Group Leader working in our FSM Ireland Analytical Laboratories which operate 24/7. Selected candidate will manage a team of FI/FA engineers supporting both electrical and physical failure analysis (EFA / PFA) activities. Team works closely with Yield Analysis team members to identify root cause of failures enabling yield ramp-up and process optimization in early production stage, supporting both internal and external customers. FI/FA Group Leader’s responsibilities include (but are not limited to): Nurture, grow & lead newly formed team, responsible for team health and people management, including hiring, technical coaching, skill development, training, and performance management. Review team’s work and ensure technical accuracy, provide guidance and recommendations on approaches to characterize complex analyses. Deliver world class operational performance in safety, quality, and lab throughput along with tactical management of area. Understand area workflows and equipment, help manage tool fleet including optimizing area to increase output & reduce tool down time. Present results of key analyses to internal and external customers. Candidate should have the following behavioral skills: Demonstrated strength in leadership, teamwork, problem solving, and effective oral and written communication skills. Desire to learn and expand knowledge in field. Ability to work with multi-functional, multi-cultural teams. Strong in decision making and problem solving. A good motivator, with ability to listen. Qualifications Minimum Qualifications: Bachelor's degree in science and engineering major. Ireland candidates minimum Level 8 Bachelors' degree. 4+ years' experience in a semiconductor failure analysis laboratory. Preferred Qualifications: Advanced degree (Master's or Ph.D.) in science and engineering major. 10+ years’ experience in a semiconductor failure analysis laboratory supporting advanced technology node technology development. Strong understanding of TEM sample preparation and imaging. 4+ years’ experience with 6T SRAM & logic failure analysis. Strong technical understanding of modern fault isolation & failure analysis techniques, from fault isolation, nanoprobing through physical analysis. Understanding of FinFET technology architecture, including Cu metallization. Basic understanding on fabrication processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. #J-18808-Ljbffr
Job Description Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and 2 new greenfield sites in Ohio and Germany. Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development (TD) team, and FSM fab managers. This job requisition is seeking a Failure Analysis & Fault Isolation (FA/FI) Engineer working in our FSM Ireland Analytical Laboratories which operate 24/7. Selected candidate will work in a dynamic team supporting technology development & yield improvement through targeted electrical and physical failure analyses (EFA / PFA). Team will support both product and test chips, spanning from data analysis & workflow planning, sample preparation, nanoprobing, tester based & static fault isolation, report generation and customer presentation. Engineers may focus on specific modules or cover full analysis flow. FI/FA Engineers responsibilities include (but are not limited to): Review incoming support requests and determine initial failure analysis / fault isolation workflow to identify & visualize root cause. Hands on operation of laboratory equipment, such as curve tracing, photon emission microscopy, laser stimulation (OBIRCH), and infrared imaging systems. Conduct failure analysis workflows using Ga & plasma FIBs, nanoprobing and sample preparation equipment. Mentor and coordinate workflows with supporting technicians. Interact with Transmission Electron Imaging (TEM) experts to interpret and explain failure root cause. Support continual improvement & development of new workstreams & techniques. Develop a thorough understanding of upstream and downstream techniques in the lab and work seamlessly with peers of different disciplines to get high quality results with fast throughput time. Present results of key analyses to internal and external customers. Candidate should have the following behavioral skills: Demonstrated strength in teamwork, analytical problem solving, and effective oral and written communication skills. Inquisitive, desire to learn and expand knowledge in field. Ability to work with multi-functional, multi-cultural teams. Strong in decision making and problem solving. Qualifications Minimum Qualifications: Bachelor's degree in science and engineering major. Ireland candidates minimum Level 8 Bachelors' degree. 2+ years' experience in a semiconductor failure analysis laboratory. Preferred Qualifications: Advanced degree (Master's or Ph.D.) in science and engineering major. 4+ years’ experience in a semiconductor failure analysis laboratory supporting advanced technology node technology development. 4+ years’ experience with 6T SRAM & logic failure analysis. Experience operating fault isolation & failure analysis tools. Understanding of FinFET technology architecture. Knowledge of wafer fabrication and general microelectronics. Knowledge of electrical and physical failure analysis flows for semiconductor. Hands on experience operating laboratory equipment. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. #J-18808-Ljbffr
Job Description Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon, and 2 new greenfield sites in Ohio and Germany. Intel recently created the HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with the Technology Development (TD) team and FSM fab managers. This job requisition is seeking a Transmission Electron Microscopy (TEM) Engineer working in our FSM Ireland Analytical Laboratories which operate 24/7. The selected candidate will work in a dynamic team supporting technology development & yield improvement. The TEM group uses the latest state-of-the-art workflows leveraging a high level of autonomy. TEM engineers may support conventional manual TEM or oversee engineering for autonomous lines. This requisition has multiple openings on both night and day shifts. TEM Engineers responsibilities include (but are not limited to): Review incoming requests and determine appropriate TEM workflow strategy. Prepare plans as appropriate for the TEM sample preparation team. Hands-on operation of laboratory equipment, such as TEM microscopes. Monitoring & oversight of autonomous TEM sample production line, ensuring maximum uptime and sample throughput. Interpretation of complex TEM results, translating to actionable data for FAB process and integration teams. Support continual improvement & development of new workstreams & techniques. Develop a thorough understanding of manual and autonomous TEM operation lines. Mentor junior TEM engineers & TEM preparation technicians. Candidate should have the following behavioral skills: Demonstrated strength in teamwork, analytical problem solving, and effective oral and written communication skills. Inquisitive, with a desire to learn and expand knowledge in the field. Ability to work with multi-functional, multi-cultural teams. Strong decision-making and problem-solving skills. Qualifications Minimum Qualifications: Master’s degree in science and engineering major. Greater than 2 years’ experience in a TEM engineering laboratory. Preferred Qualifications: Ph.D. in science and engineering major. Greater than 5 years’ experience operating a Transmission Electron Microscope and material characterization techniques. Experience with various types of TEM sample preparation. Strong TEM interpretation skillset. Understanding of FinFET technology architecture. Knowledge of wafer fabrication and general microelectronics. Willingness to work night shift. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. #J-18808-Ljbffr
Job Description Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and a new greenfield site in Ohio. Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development (TD) team and FSM fabs. This job requisition is seeking a Failure Analysis Technician in our FSM Ireland Analytical Laboratories which operates 24/7. Selected candidates will work in either physical failure analysis or TEM sample preparation. There are several openings for this role, with the majority being on a night shift schedule. Failure Analysis Technician responsibilities include (but are not limited to): Work hands on in laboratory operating various types of equipment such as dual beam FIBs, plasma FIBs, polishing and grinding equipment, optical microscopes and more. Learn to prepare complex precise laboratory samples, such as TEM lamella, layer by layer deprocessing, and nanoprobe sample preparation, etc. Meet sample throughput and quality objectives. Identify opportunities to improve sample preparation processes. Monitor equipment to ensure maximum process uptime. Learn and apply new procedures. Candidate should have the following behavioral skills: Problem-solving with self-initiative and self-learning capabilities. Ability to work with multi-functional, multi-cultural teams. Must demonstrate solid communication skills. Position will start on a day shift schedule for lab start up and training and will then move to a night shift schedule. Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: Level 6 or 7 in certificate / diploma (QQI) in any science or engineering discipline. 3 years' experience working with electron microscopy equipment (SEM, FIB, TEM, etc.) Preferred Qualifications Experience working in production line or environment following a detailed procedure. Demonstrated ability to operate complex machinery. 6 years' experience working in semiconductor failure analysis or SEM laboratory. Experience operating semiconductor sample preparation equipment. Willingness to work on shift. Positions available on front-end / back-end of week on nights shift. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. #J-18808-Ljbffr
